FULLY EMBEDDED SIMULATION
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High Frequency Simulation of a Through-Silicon Via (TSV) for 3D Chip Using HFWorks for Solidworks

High Frequency Simulation of a Through-Silicon Via (TSV) for 3D C...


High Frequency Simulation of a Through-Silicon Via (TSV) for 3D Chip U...

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HFWorks
EMC Simulation of an Intel CPU with a heatsink

EMC Simulation of an Intel CPU with a heatsink


Electromagnetic compatibility simulation of a Dual Die CPU with and wi...

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