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    High Frequency Simulation of a Through-Silicon Via (TSV) for 3D Chip Using HFWorks for Solidworks

    High Frequency Simulation of a Through-Silicon Via (TSV) for 3D Chip Using HFWorks for Solidworks

    High Frequency Simulation of a Through-Silicon Via (TSV) for 3D Chip Using HFWorks for Solidworks

    HFWorks
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    EMC Simulation of an Intel CPU with a heatsink

    EMC Simulation of an Intel CPU with a heatsink

    Electromagnetic compatibility simulation of a Dual Die CPU with and without a heatsink.

    HFWorks
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