Chip-Package-Board System Simulation

This application note models an Intel dual-die CPU as a dual-fed microstrip patch to study electromagnetic compatibility at 2.05 and 4.9 GHz. It compares S-parameters, field distributions, and temperature with and without a heatsink, and evaluates the effect of heatsink height. The results show that resonant frequencies and scattering parameters are dominated by the internal package, while the heatsink mainly influences thermal distribution, with simulations closely matching published measurement data.

Study how TSV technology boosts chip performance and efficiency. Learn about its role in reducing latency, minimizing power consumption, and optimizing semiconductor design.