Thermische Kopplung
Analysieren Sie die thermischen Auswirkungen von RF-Leistungsverlusten, einschließlich Erwärmung und möglicher Ausfälle.
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RF & Microwave
RF & Microwave ist das Hochfrequenz-Simulationsmodul von EMWORKS, das speziell für die Herausforderungen in der Entwicklung von Hochfrequenz-, Mikrowellen- und Hochgeschwindigkeits-Digitalschaltungen entwickelt wurde. Dieses Modul zeichnet sich durch die präzise Analyse des elektromagnetischen Wellenverhaltens aus und gewährleistet zuverlässige Simulationen für eine Vielzahl hochfrequenter Anwendungen wie Antennen, Resonatoren, Filter und Mikrowellenkomponenten.
Spezialisierung auf Hochfrequenztechnik
RF & Microwave bietet unvergleichliche Präzision bei hochfrequenten elektromagnetischen Simulationen und ermöglicht es Ingenieuren, mit Vertrauen und Effizienz zu konstruieren.
Vielseitige Analysefunktionen
Deckt ein breites Anwendungsspektrum ab – von Antennen und Hohlleitern bis hin zu Signalintegrität und elektromagnetischer Verträglichkeit (EMV).
TZeitbereichslösungen
Diagnostizieren und beheben Sie Probleme wie Diskontinuitäten in Steckverbindern, Kabeln und Hochgeschwindigkeitsverbindungen.
Integrierte thermische Analyse
Stellen Sie eine zuverlässige Leistung sicher, indem Sie das thermische Verhalten zusammen mit den elektromagnetischen Eigenschaften analysieren.
RF & MICROWAVES Analysis Options
RF & MICROWAVES provides several analysis types commonly needed in RF and microwave
design.
S-Parameter
Mit der S-Parameter- und TDR-Simulation können Sie die Streuparameter für HF- und Mikrowellenkomponenten berechnen, einschließlich Einfügung und Rückflussdämpfung."
Resonanz
Software für elektromagnetische Resonanzkammern zur Berechnung der Resonanzfrequenz in HF- und Mikrowellenkammern sowie der dielektrischen und Leiterqualitätsfaktoren."
Antennen
Das Antennendesign-Softwaremodul, mit dem Sie Antennendesign, Modellierung und Validierung beschleunigen können. Berechnet Antennengewinn, Wirkungsgrad und Impedanz."
Time Domain
Analyze transient behaviour in interconnects and components, including reflections from discontinuities, crosstalk and dispersion in high-speed signal paths.
Multiphysikalische Kopplung
Die Integration von elektromagnetischen und thermischen Analysen ermöglicht es den Nutzern, Simulationen durchzuführen.
Applications of RF & MICROWAVES
RF & MICROWAVES supports a range of high-frequency applications, including:
Chip, Package, Board Systems
Model signal paths from chip through package to PCB to study impedance, reflections and coupling across the entire chain, including the impact of layout and stack-up choices.
Connectors and Transitions
Simulate 3D connectors, launches and transitions (for example coax-to-microstrip or microstrip-to-stripline) to evaluate return loss, mode conversion and local field concentrations.
Electro-Thermal
Compute RF losses in components or interconnects and use them as heat sources in coupled thermal studies to estimate temperature rise and identify regions that may exceed material or reliability limits.
EM Exposure
Analyze field distributions in and around devices to estimate exposure levels in regions of interest and check against defined limits in representative operating scenarios.
Filters
Evaluate S-parameters, field distributions and Q-factors in filters to confirm insertion loss, return loss and rejection over the required frequency bands.
Passive Components
Model inductors, capacitors, couplers and other passive RF components to study parasitics, frequency response and loss behaviour in realistic 3D geometries.
Planar-Printed Antennas
Simulate printed and planar antennas on substrates to assess impedance, bandwidth, radiation patterns and efficiency, including the influence of ground planes and nearby structures.
Printed Circuit Boards (PCBs)
Analyze high-speed traces and RF sections on PCBs for impedance, crosstalk and coupling, taking into account stack-up, via fields and proximity to other conductors.
Resonators
Identify resonant frequencies, mode shapes and Q-factors in cavity, dielectric and planar resonators to support the design of frequency-selective structures.
Transmission Lines
Use frequency-domain and time-domain (including TDR-style) analysis to study reflections, dispersion and losses in transmission lines, cables and interconnects over the relevant frequency range.
Waveguide Antennas
Model waveguide-based antennas and apertures to evaluate radiation patterns, gain and impedance, and to study how geometry changes affect the overall response.
Why teams use RF & MICROWAVES
Design validation before hardware
To check whether the chosen geometry, stack-up and materials deliver the required S-parameters, bandwidth, matching and radiation characteristics at the target frequencies.
Understanding fields in complex 3D structures
To see where fields, currents and losses are concentrated in connectors, transitions, packages, enclosures and waveguide structures, and how changes in geometry affect them.
Troubleshooting and refinement
To investigate unexpected resonances, coupling paths, EMI/EMC issues or sensitivity to manufacturing tolerances that are hard to isolate from measurements alone.
Supporting layout and packaging decisions
To evaluate how PCB routing, via placement, shielding, grounding and housing details influence performance and interference between nearby circuits or antennas.
Complementing circuit simulation and measurement
To provide 3D field-based results that sit alongside circuit-level simulation and lab measurements, helping to explain observed behaviour and guide design changes.
Evaluate RF & MICROWAVES on your designs
If you work with RF, microwave or high-speed components and need field-level simulation in addition to circuit tools and measurements, you can evaluate RF & MICROWAVES as part of EMWORKS.
A short trial on one or two representative models is usually enough to see whether the module fits your workflows and accuracy requirements.