熱結合
加熱や潜在的な破壊を含む、RF電力損失の熱的影響を解析します。
EMWORKS における高周波電磁界シミュレーションモジュールで、アンテナ、フィルタ、共振器、インターコネクトなどの RF コンポーネントの解析に対応しています。
アンテナや導波管から信号の整合性、電磁両立性(EMC)まで、幅広いアプリケーションに対応します。
コネクタ、ケーブル、高速インターコネクトにおける不連続性などの問題を診断・解決します。
熱的挙動と電磁特性を同時に解析することで、信頼性の高い性能を確保します。
加熱や潜在的な破壊を含む、RF電力損失の熱的影響を解析します。

To check whether the chosen geometry, stack-up and materials deliver the required S-parameters, bandwidth, matching and radiation characteristics at the target frequencies.
To see where fields, currents and losses are concentrated in connectors, transitions, packages, enclosures and waveguide structures, and how changes in geometry affect them.
To investigate unexpected resonances, coupling paths, EMI/EMC issues or sensitivity to manufacturing tolerances that are hard to isolate from measurements alone.
To evaluate how PCB routing, via placement, shielding, grounding and housing details influence performance and interference between nearby circuits or antennas.
To provide 3D field-based results that sit alongside circuit-level simulation and lab measurements, helping to explain observed behaviour and guide design changes.
If you work with RF, microwave or high-speed components and need field-level simulation in addition to circuit tools and measurements, you can evaluate RF & MICROWAVES as part of EMWORKS.
A short trial on one or two representative models is usually enough to see whether the module fits your workflows and accuracy requirements.