Thermal Coupling in EMWORKS

Thermal Coupling in EMWORKS

Thermal coupling in EMWORKS links electromagnetic solvers with steady-state or transient heat transfer. It lets you use electromagnetic losses as heat sources and, when needed, feed temperature back into the EM model for temperature-dependent material properties.

Typical use:

• Map Joule (I²R), core, dielectric, and eddy-current losses from EM analysis to a thermal model

• Compute temperature distribution, heat flux, and cooling performance in solids and fluids

• Optionally update EM material properties (e.g., resistivity, permeability, conductivity) based on temperature for iterative EM–thermal solutions

Features of EMWORKS' Thermal Coupling

• EM losses as heat sources
  Use Joule (I²R), core, eddy-current, and dielectric losses from EM analysis as volumetric or surface heat sources.

• Steady-state and transient thermal analysis
  Solve steady-state and time-dependent temperature fields in solids and, where applicable, cooling regions.

• Temperature distribution and hotspots
  Compute temperature, temperature gradients, and heat flux to identify hotspots and evaluate cooling efficiency.

• Temperature-dependent EM properties
  Update conductivity, permeability, permittivity, or resistivity vs temperature for iterative EM–thermal coupling.

• Thermal–structural linkage
  Export temperature fields to structural analysis to evaluate thermal expansion, stress, and deformation.

• Material and cooling comparison
  Compare materials, heat sinks, and cooling configurations against temperature limits and derating curves.

Applications and Devices for Thermal Coupling

Typical use cases:

• Electric machines (motors, generators)
  Copper and core losses → temperature rise in stator, rotor, slots, end windings; check insulation limits and derating.

• Transformers and reactors
  Winding and core losses → oil/air temperature, hotspot evaluation, cooling design, and lifetime estimates.

• Power electronics (inverters, converters, rectifiers)
  Semiconductor and conductor losses → junction and case temperatures, heat sink and cooling evaluation.

• Busbars, cables, and connectors
  I²R losses → conductor and contact temperatures, ampacity checks, and overheating risk.

• Battery packs and energy storage
  Losses in cells and busbars → temperature distribution, thermal runaway risk, and cooling strategy.

• High-power and RF devices
  Dielectric, conductor, and coil losses → temperature rise in coils, resonators, antennas, and matching networks.

• Industrial and automotive systems
  EM losses in drives, chargers, and auxiliaries → temperature limits for components and enclosures.

• Medical and scientific equipment
  Coils and power modules in MRI, NMR, and lab equipment → temperature control and duty-cycle limits.

Results of EMWORKS' Thermal Coupling

After running a study with the thermal solution option on, you can view the following thermal quantities:

• Temperature

Temperature distribution

• Temperature Gradient:

TGx: Temperature gradient in the x direction
TGy: Temperature gradient in the y direction
TGz: Temperature gradient in the z direction
TGr: Resultant Temperature gradient

• Heat Flux :

FLx: Heat Flux in the x direction
FLy: Heat Flux in the y direction
FLz: Heat Flux in the z direction
FLr: Heat Flux gradient.
where:
x, y, and z refer to the global coordinate system.