Thermal Coupling in EMWORKS
Thermal coupling in EMWORKS links electromagnetic solvers with steady-state or transient heat transfer. It lets you use electromagnetic losses as heat sources and, when needed, feed temperature back into the EM model for temperature-dependent material properties.
Map Joule (I²R), core, dielectric, and eddy-current losses from EM analysis to a thermal model
Compute temperature distribution, heat flux, and cooling performance in solids and fluids
Optionally update EM material properties (e.g., resistivity, permeability, conductivity) based on temperature for iterative EM–thermal solutions
Key Features of EMWORKS Thermal Coupling
1
EM losses as heat sources: Use Joule (I²R), core, eddy-current, and dielectric losses from EM analysis as volumetric or surface heat sources.
2
Steady-state and transient thermal analysis: Solve steady-state and time-dependent temperature fields in solids and, where applicable, cooling regions.
3
Temperature distribution and hotspots: Compute temperature, temperature gradients, and heat flux to identify hotspots and evaluate cooling efficiency.
4
Temperature-dependent EM properties: Update conductivity, permeability, permittivity, or resistivity vs temperature for iterative EM–thermal coupling.
5
Thermal–structural linkage: Export temperature fields to structural analysis to evaluate thermal expansion, stress, and deformation.
6
Material and cooling comparison: Compare materials, heat sinks, and cooling configurations against temperature limits and derating curves.
Applications and Devices for Thermal Coupling
Electric machines (motors, generators) – fCopper and core losses → temperature rise in stator, rotor, slots, end windings; check insulation limits and derating.
Transformers and reactors – Winding and core losses → oil/air temperature, hotspot evaluation, cooling design, and lifetime estimates.
Power electronics (inverters, converters, rectifiers) – Semiconductor and conductor losses → junction and case temperatures, heat sink and cooling evaluation.
Busbars, cables, and connectors – I²R losses → conductor and contact temperatures, ampacity checks, and overheating risk.
Battery packs and energy storage – Losses in cells and busbars → temperature distribution, thermal runaway risk, and cooling strategy.
High-power and RF devices – Dielectric, conductor, and coil losses → temperature rise in coils, resonators, antennas, and matching networks.
Industrial and automotive systems – EM losses in drives, chargers, and auxiliaries → temperature limits for components and enclosures.
Medical and scientific equipment – fCoils and power modules in MRI, NMR, and lab equipment → temperature control and duty-cycle limits.
Results of EMWORKS Thermal Coupling
Temperature
- Temperature distribution
Temperature Gradient
- TGx: Temperature gradient in the x direction
- TGy: Temperature gradient in the y direction
- TGz: Temperature gradient in the z direction
- TGr: Resultant Temperature gradient
Heat Flux
- FLx: Heat Flux in the x direction
- FLy: Heat Flux in the y direction
- FLz: Heat Flux in the z direction
- FLr: Heat Flux gradient
where: x, y, and z refer to the global coordinate system.