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EMC Modeling of an Intel Dual Die CPU using HFWorks/ SolidWorks

Thursday, January 19, 2017,
02:00 PM EST, 07:00 PM GMT

EMI/EMC compliance has recently become vital for electronic and chip designers. This paradigm shift is primarily due to the ever increasing chip density and frequency as well as the low supply voltage. Paradoxically, the chip has literally become just like an antenna radiating a significant amount of electromagnetic energy, especially when a heatsink is present in the design. A typical device is an Intel Quad Core processor that has two cores in each die and two dies in the same package and, of course, a heatsink.

In this webinar, we will show you how the duo HFWorks and SolidWorks are used to study the EMC aspects of an Intel Dual Die CPU around ISM radio bands, i.e frequency of 2.45 GHz and 5.8 GHz. Electrical results such as return loss (S11), near- and far- and electromagnetic fields will be presented and compared to actual measurements. Thermal results including the temperature distribution and gradient will also be presented with and without the heat sink. Respecting the EMI/EMC regulatory requirement is not just a good idea, it is the law.