WIREBONDS: THE WEAK LINK
Wirebonds play a crucial role in connecting chips or substrates using tiny wires made typically of gold or aluminum. However, these wirebonds are susceptible to deformation or even burnout due to their delicate nature. Semiconductor engineers regard them as the weakest link in the IC assembly process, necessitating careful design considerations. Factors such as wirebond impedance, attenuation, resistance, matching, temperature, and deformation must all be meticulously taken into account during the design phase.
A SOLIDWORKS model of two wirebonds
ONE-STOP SOLUTION
HFWorks offers a unified solution for wirebond modeling, accommodating wire frequency, shape, and material diversity. Its streamlined interface simplifies wirebond geometry creation, importation, and editing. During pre-processing, HFWorks consolidates electrical, thermal, and structural constraints into a single study environment, eliminating the need for separate classifications. As it computes electrical parameters, HFWorks simultaneously evaluates thermal loads, feeding them into the built-in thermal solver. Post-processing conveniently presents consolidated electrical, thermal, and structural results, enabling comprehensive analysis without the need for separate studies or external software.
Temperature distribution around the wirebonds
SUMMARY AND TAKEAWAYS
HFWorks simplifies wirebond modeling, providing semiconductor engineers with a unified platform for efficient design and optimization. Its integrated multi-physics environment ensures accuracy and reliability, empowering engineers to excel in semiconductor applications.
Structural deformation of the wirebonds