Simulation elektromagnetischer Felder für Pakete, Chips und Leiterplatten
Simulate chip–package–board systems to predict impedance, delay, crosstalk, losses and EMI in high-speed electronics.
Software für elektromagnetische Felder für Anwendungen im Elektronikdesign: Gehäuse, Chips, Leiterplatten, Steckverbinder, Kühlkörper, CPUs, SIPs, ICs.
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Chip Package Board Systeme
Use EMWorks to simulate chip-package-board systems on full 3D geometry. Analyze signal integrity, power integrity, crosstalk, and return paths so you can optimize high-speed channels and PDNs before fabrication. -
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Leiterplatten
Use EMWorks to simulate real PCB layouts, including traces, vias, planes and components. Evaluate signal and power integrity, EMI, and heating so you can fix issues and optimize stackups before fabrication. -
Kondensatoren
Use EMWorks to model capacitors of any shape—parallel plate, coaxial, busbar, and custom 3D structures. Extract capacitance, visualize electric fields, evaluate parasitics, and estimate breakdown limits before building hardware.