パッケージ、チップ、PCB の電磁界解析
Simulate chip–package–board systems to predict impedance, delay, crosstalk, losses and EMI in high-speed electronics.
パッケージ、チップ、PCB、コネクタ、ヒートシンク、CPU、SIP、IC などのエレクトロニクス設計応用向けの電磁界ソフトウェア。
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チップパッケージボードシステム
Use EMWorks to simulate chip-package-board systems on full 3D geometry. Analyze signal integrity, power integrity, crosstalk, and return paths so you can optimize high-speed channels and PDNs before fabrication. -
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プリント回路基板（PCB）
Use EMWorks to simulate real PCB layouts, including traces, vias, planes and components. Evaluate signal and power integrity, EMI, and heating so you can fix issues and optimize stackups before fabrication. -
コンデンサ
Use EMWorks to model capacitors of any shape—parallel plate, coaxial, busbar, and custom 3D structures. Extract capacitance, visualize electric fields, evaluate parasitics, and estimate breakdown limits before building hardware.